The SE5007T-R is a high-performance RF front-end module from Skyworks, designed for multi-band LTE and 5G applications in mobile and IoT devices. This compact surface-mount component integrates a power amplifier (PA), filters, and switch functionality, enabling efficient transmission in cellular networks. It supports key LTE bands (e.g., Band 4, 7, and 20) and operates across a frequency range of 1.7 GHz to 2.2 GHz, with a maximum output power of 30 dBm. The module features a small form factor (3.5 mm × 4.5 mm) and optimized thermal performance, making it ideal for space-constrained designs in smartphones, tablets, and connected devices.
Key Features
The SE5007T-R delivers exceptional linearity with an ACPR (Adjacent Channel Power Ratio) of -40 dBc at 25 MHz offset, ensuring minimal signal interference. It offers low insertion loss (<1.5 dB) and high power-added efficiency (PAE > 30%) to maximize battery life. The integrated power detector provides real-time output power monitoring for adaptive transmit control. Its robust design includes input and output matching networks, harmonic filtering, and overvoltage protection, simplifying system integration. The module operates over an extended temperature range (-40°C to +85°C) and meets严苛的射频标准, ensuring reliability in diverse environments.
Applications
Primarily used in 4G/LTE mobile devices, the SE5007T-R is critical for cellular base stations, IoT gateways, and M2M communication modules requiring multi-band transmit capabilities. It is widely employed in automotive telematics, smart meters, and industrial IoT devices where compact size and high spectral efficiency are essential. Its integration of PA and filtering also suits applications in femtocells, repeaters, and private network infrastructure.
Summary
The SE5007T-R combines multi-band performance, high efficiency, and compact integration, making it a key enabler for next-generation cellular and IoT devices demanding reliable, high-speed connectivity. Its optimized RF performance, thermal management, and simplified design footprint cater to the growing need for energy-efficient, multi-standard communication solutions in mobile and industrial applications. This module is essential for engineers designing cost-effective, high-performance transmit chains in 4G/5G-enabled systems.