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AS4C256M16D4-83BCN
AS4C256M16D4-83BCN
Brand:Alliance Memory Inc
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D/C:24+
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Datasheet:---
In-Stock:2090
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Product Attributes
Mfr
Alliance Memory, Inc.
Series
-
Memory Type
Volatile
Memory Format
DRAM
Technology
SDRAM - DDR4
Memory Size
4Gbit
Memory Organization
256M x 16
Memory Interface
Parallel
Clock Frequency
1.2 GHz
Write Cycle Time - Word, Page
15ns
Access Time
18 ns
Voltage - Supply
1.14V ~ 1.26V
Operating Temperature
0°C ~ 95°C (TC)
Mounting Type
Surface Mount
Product Description

AS4C256M16D4-83BCN: High-Performance, Low-Power 4Gbit DDR4 SDRAM Module

The AS4C256M16D4-83BCN is a 4Gbit (512MB) DDR4 SDRAM memory IC manufactured by Alliance Semiconductor (now part of Adesto Technologies/Dialog Semiconductor or under its legacy branding). Designed for high-speed, energy-efficient computing, this device targets applications requiring reliable, low-latency memory in embedded systems, networking equipment, industrial automation, and consumer electronics.


Key Features

  1. High-Density Memory Configuration
  • 4Gbit (512MB) Capacity: Organized as 256M x 16 bits (16-bit data width), supporting x16 I/O configuration for wide data paths.
  • 16 Internal Banks: Enables efficient concurrent access to multiple memory blocks, improving system throughput.
  1. DDR4 Speed & Efficiency
  • Data Rate: Up to 2400 Mbps (PC4-19200), with optional lower speeds (e.g., 2133 Mbps) for power-sensitive designs.
  • Low Voltage Operation: Runs on 1.2V ±0.06V (VDD/VDDQ), reducing power consumption by ~30% compared to DDR3 (1.5V).
  1. Advanced Power Management
  • Auto-Self-Refresh (ASR) & Temperature-Compensated Self-Refresh (TCSR): Optimizes refresh cycles to minimize power use in idle states.
  • Partial Array Self-Refresh (PASR): Allows refreshing only active memory regions, further cutting power.
  • Data Bus Inversion (DBI): Reduces switching noise and power by inverting data when I/O transitions exceed 50%.
  1. Robust Signal Integrity & Timing
  • On-Die Termination (ODT): Improves signal quality by reducing reflections on high-speed data lines.
  • Write Leveling & Read/Write Leveling: Calibrates timing between memory controller and DRAM for reliable operation at high speeds.
  • Command/Address (CA) Parity: Detects and corrects single-bit errors in command/address signals, enhancing system reliability.
  1. Industrial-Grade Reliability
  • Extended Temperature Range: Operates reliably from -40°C to +95°C, suitable for automotive, industrial, and outdoor deployments.
  • Anti-Sulfuration Resistance: Protects against corrosion in harsh environments (e.g., automotive under-hood or industrial plants).
  1. Flexible Packaging & Form Factors
  • 96-Ball FBGA Package: Compact 7.5mm × 14mm × 1.2mm footprint with 0.8mm ball pitch, ideal for space-constrained designs.
  • RoHS-Compliant & Halogen-Free: Meets environmental regulations for e-waste reduction.


Applications

  • Networking & Telecom:
  • Routers, switches, and baseband units (BBUs) requiring high-bandwidth, low-latency memory for packet processing.
  • Industrial Automation:
  • PLCs, motion controllers, and robotics needing reliable memory in extreme temperatures.
  • Automotive Electronics:
  • ADAS, infotainment systems, and gateway controllers with automotive-grade temperature and anti-sulfuration requirements.
  • Embedded Computing:
  • Single-board computers (SBCs), edge devices, and IoT gateways with power-efficient DDR4 support.
  • Consumer Electronics:
  • Set-top boxes, gaming consoles, and smart TVs leveraging DDR4’s speed and density.


Advantages

  • Energy Efficiency: Low 1.2V operation and power-saving features (ASR, PASR, DBI) extend battery life in portable/embedded systems.
  • High Reliability: Industrial-grade temperature support, anti-sulfuration, and ECC-like CA parity ensure robustness in harsh conditions.
  • Scalable Performance: DDR4-2400 speed enables faster data processing without sacrificing power efficiency.
  • Compact Design: Small FBGA package fits densely populated PCBs, reducing board size and cost.
  • Cost-Effective Solution: Matures DDR4 technology offers a balance of performance and affordability for mid-range applications.


Conclusion

The AS4C256M16D4-83BCN is a feature-rich DDR4 SDRAM IC optimized for high-speed, low-power, and industrial-grade reliability. Its combination of 4Gbit density, 1.2V operation, and extended temperature support makes it ideal for engineers designing embedded systems, networking gear, automotive electronics, and industrial controllers.


For evaluation, Alliance Semiconductor (or its parent company) provides development kits, reference designs, and technical documentation. Contact authorized distributors or visit the manufacturer’s website for product samples, datasheets, and customization options.

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