Audio Format Support: Supports various audio formats such as PCM, I²S, left-justified and right-justified formats, which improves the compatibility and flexibility of the chip and meets the needs of different application scenarios.
Built-in DSP Functions: It has multiple built-in digital signal processing (DSP) functions, including equalizer, 3D sound field enhancement, volume control, etc. These functions help users to achieve more audio processing effects and improve the overall performance of the chip.
Interface Protocol Support: The chip supports multiple interface protocols like SPI and I²C, making it easy to communicate with other devices and expanding its application range.
Low Power Consumption Design: Adopts a low-power design and supports multiple power modes, which can meet the requirements of various application scenarios and help to save power.
Dual ADC/DAC: Equipped with 2 ADCs and 2 DACs, which are highly integrated in the chip and can realize high-quality audio acquisition and playback.
Mechanical Characteristics
Dimensions: 9.7mm x 4.4mm
Height: 1.20mm
Pin Count: 28
Applications
Smartphones: Ideal for high-fidelity audio recording and playback in smartphones.
Tablets: Can be used to provide high-quality audio processing for multimedia applications on tablets.
Laptops: Suitable for laptop audio systems to enhance audio quality.
Audio Acquisition Devices: Such as digital recorders and professional audio capture equipment.
Audio Processing Devices: Such as audio mixers and audio effect processors.
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